ビジネス
通貨単位:HKD
2024/H1
銘柄名売上高比率
后段半导体传输介质7,407.4万93.04%
MEMS及传感器封装553.8万6.96%
商品
通貨単位:HKD
2024/H1
銘柄名売上高比率
销售托盘及托盘相关产品7,353.5万92.37%
销售MEMS及传感器封装553.8万6.96%
销售载带53.9万0.68%
地域
通貨単位:HKD
2024/H1
銘柄名売上高比率
Southeast Asia2,599.5万32.65%
People's Republic of China2,305.6万28.96%
Taiwan1,600.6万20.11%
香港、韩国及日本919.5万11.55%
United States of America.343万4.31%
Europe193万2.42%
すべて表示