The company is a high-end advanced packaging testing service provider for integrated circuits. Currently, it focuses on the field of display driver chips and has a leading position in the industry. The company is one of the earliest advanced packaging and testing companies for display driver chips in China that has introduced a 12-inch wafer gold bump production line and achieved mass production. It has the ability to test the entire 8-inch and 12-inch wafer packaging process. The company is mainly engaged in high-end advanced packaging testing services for integrated circuits. The main products are LCD panel display driver chips (DDI), touch and display driver integrated chips (TDDI), and AMOLED panel display driver chips. Honors such as Best Quality Supplier issued by Lianyong Technology, the world's leading display driver IC design company.